Semi-flexible, cold curable, flame retardant (UL-94, V-0 listed) potting system with very good dielectrical properties.
Micares® X1087NM R11 is a semi-flexible casting resin system based on polyurethane, consisting of resin and hardener. This two component potting compound, designed for use in the electrical engineering and the electronics has especially low viscosity and is cold and thermal-curing. Micares® X1087NM R11 is solvent-free and liquid at ambient temperature. The resin contains the filler and is already degassed.
| - Mix ratio: | 5: 1 (by weight) |
| - Mix viscosity*: | 1.5 - 2.5 Pas (25 °C) |
| - Mix density*: | 1.37 g/cm3 |
| - Tg*: | 5 - 15 °C |
| - Shore D*: | 45 |
| - Loss factor*: | 0.08 |
| - Dielectrical strength*: | 16 - 19 kV/mm (on 2 mm plates) |
| - Thermal Class*: | B |
| - Thermal conductivity*: | 0.45 W/°Km |
* Typical values (not specifications)
Gel time and colour can be adjusted to customer needs.
For further details see data sheet ( Downloads)