Rigid, hot curable, thermal class F potting system with excellent dielectrical properties.
Micares® 850 R1 is a casting resin system based on polyurethane, consisting of resin and hardener. This two component potting compound designed for use in the electrical engineering and the electronics is warm to thermal-curing. Micares® 850 R1, it is solvent free and liquid at ambient temperature (RT). The resin component contains the filler and is already degassed.
| - Mix ratio: | 4: 1 (by weight) |
| - Mix viscosity*: | 1.0 - 2.0 Pas (25 °C) |
| - Mix density*: | 1.60 - 1.63 g/cm3 |
| - Tg*: | 75 - 90 °C |
| - Shore D*: | 75 - 80 |
| - Loss factor*: | 0.007 |
| - Dielectrical strength*: | 18 - 22 kV/mm (on 2 mm plates) |
| - Thermal Class*: | F |
| - Thermal conductivity*: | 0.45 - 0.60 W/°Km |
* Typical values (not specifications)
Gel time and colour can be adjusted to customer needs.
For further details see data sheet ( Downloads)