Flexible, low viscosity, unfilled, cold curable, thermal class E casting system with excellent dielectrical properties.
Micares
® 761 R19 is a casting resin system based on polyurethane, consisting of resin and hardener. This two component potting compound, designed for use in the electronics has especially low viscosity and is cold to thermal-curing. Micares
® 761 R19 is solvent-free and liquid at ambient temperature (RT). The resin is unfilled and degassed.
| - Mix ratio: | 5 : 1 (by weight) |
| - Mix viscosity*: | 0.5 - 0.8 Pas (25 °C) |
| - Mix density*: | 1.1g/cm3 |
| - Shore A*: | 50 - 60 |
| - Loss factor*: | 0.01 |
| - Dielectrical strength*: | 16 - 18 kV/mm (on 2 mm plates) |
| - Thermal Class*: | E |
| - Thermal conductivity*: | 0.30 W/°Km |
* Typical values (not specifications)
Gel time and colour can be adjusted to customer needs.
For further details see data sheet ( Downloads)