Rigid, cold curable potting system with excellent dielectrical properties.
Micares
â 751 R1 is a casting resin system based on polyurethane, consisting of resin and hardener. This two component potting compound, designed for use in the electrotechnics and the electronics is cold and thermal-curing. Micares
® 751 R1 is solvent-free and liquid at ambient temperature (RT). The resin component contains the filler and is degassed.
| - Mix ratio: | 5 : 1 (by weight) |
| - Mix viscosity*: | 3.0 - 3.5 Pas (25 °C) |
| - Mix density*: | 1.70 - 1.75 g/cm3 |
| - Tg*: | 55 - 65 °C |
| - Shore D*: | 80 |
| - Loss factor*: | 0.01 |
| - Dielectrical strength*: | 18 - 20 kV/mm (on 2 mm plates) |
| - Thermal Class*: | B |
| - Thermal conductivity*: | 0.60 - 0.70 W/°Km |
* Typical values (not specifications)
Gel time and colour can be adjusted to customer needs.
For further details see data sheet ( Downloads)