Rigid, heat curable casting system with excellent dielectrical properties also at elevated temperature.
Micares® 700 R1 is a casting resin system based on polyurethane, consisting of resin and hardener. This two component potting compound, designed for use in the electrotechnics and the electronics, is thermal-curing. Micares® 700 R1 is solvent-free and liquid at ambient temperature (RT). The resin component contains the filler and is degassed.
| - Mix ratio: | 2 : 1 (by weight) |
| - Mix viscosity*: | 2.5 - 3.0 Pas (25 °C) |
| - Mix density*: | 1.50 - 1.55 g/cm3 |
| - Tg*: | 120 - 135 °C |
| - Shore D*: | 90 |
| - Loss factor*: | 0.01 |
| - Dielectrical strength*: | 24 kV/mm (on 2 mm plates) |
| - Thermal Class*: | B |
| - Thermal conductivity*: | 0.60 - 0.70 W/°Km |
* Typical values (not specifications)¨
Gel time and colour can be adjusted to customer needs.
For further details see data sheet ( Downloads)